Chips, Memory, and Power | Pat Gelsinger
a16z's Raghu Raghuram and Guido Appenzeller sit down with Playground Global General Partner and former Intel CEO Pat Gelsinger to discuss the next wave of semiconductor innovation and the physical constraints shaping the AI buildout. Drawing on his experience designing Intel's 386 and 486 processors, Pat explains how AI could transform chip design, but also why faster design alone won't solve the industry's biggest problems. They examine the bottlenecks in manufacturing, memory bandwidth, advanced packaging, and power, and why today's explosion of specialized AI chips may eventually consolidate around a smaller number of architectures. They also discuss the potential for new memory technologies, the shift from copper to optical networking, and why energy capacity could become a major constraint on AI growth. Finally, they revisit Pat's VMware years to ask what virtualization might look like when infrastructure is built for agents rather than humans.
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